LP24AC01101 SFP Cage Connector 2x4 Port With Inner/Outer LightPipe

Product Specifications

LINK-PP LP24AC01101 2x4 Port SFP Stacked Receptacle and Cage Assembly with Inner/Outer LightPipes

Engineered to maximize faceplate I/O density in high-throughput data center and telecommunications infrastructure, the LINK-PP LP24AC01101 is a highly integrated 2x4 (8-port) stacked SFP cage and receptacle assembly. By organizing eight Small Form-factor Pluggable (SFP) ports into a dense, vertically stacked 2x4 matrix, this assembly empowers hardware architects to drastically increase port capacity on standard 1U and 2U networking chassis. Integrating both the mechanical EMI shielding cage and the electrical receptacles into a single, pre-aligned unit eliminates tolerance stack-up issues during printed circuit board (PCB) assembly and ensures flawless transceiver mating.

Constructed from a premium 0.25mm thick Copper Alloy with a minimum 30u" Nickel Plating, this heavy-duty cage delivers superior structural rigidity and uncompromising resistance to corrosion. The internal plastic housings are precision-molded from High-Temperature LCP (Liquid Crystal Polymer) meeting strict UL94 V-0 flammability standards. Featuring an extreme industrial operating temperature range of -40°C to +85°C, the LP24AC01101 guarantees mission-critical reliability for both climate-controlled enterprise data centers and unconditioned outdoor edge computing enclosures.

Integrated Inner & Outer LightPipes for Visual Diagnostics

Providing clear, port-level diagnostic feedback in massive 8-port stacked configurations is a complex mechanical challenge. The LP24AC01101 definitively resolves this by incorporating precision-engineered Inner and Outer LightPipes directly into the cage architecture.

• Comprehensive Port Visibility: These dedicated optical channels efficiently capture light from surface-mounted LEDs located on the PCB and route it directly to the front chassis bezel for both the upper and lower port rows simultaneously.
• Simplified Troubleshooting: Provides network administrators with immediate, unambiguous visual status indicators (such as Link Speed and Network Activity) for all eight ports, without compromising the cage’s electromagnetic shielding or requiring complex external LED light-guides.

Advanced EMI Containment & Shielding

Managing Electromagnetic Interference (EMI) in high-density, 8-port chassis configurations is a critical design mandate. The LP24AC01101 achieves superior electromagnetic compatibility (EMC) through its advanced shielding design.

• 0.25mm Nickel-Plated Copper Alloy: The thick, premium alloy acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.
• Stainless Steel EMI Springs: Heavy-duty stainless steel EMI springs surround the perimeter of the port openings. These springs ensure continuous, low-impedance electrical contact with the metallic chassis bezel, aggressively sealing the enclosure against external Radio Frequency Interference (RFI).
• Port-to-Port Isolation: Internal metallic dividers act as physical and electrical barriers, dramatically reducing near-end crosstalk (NEXT) and electromagnetic coupling between adjacent and vertically stacked SFP modules.

Mechanical Design & Automated PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-yield automated manufacturing. The LP24AC01101 leverages advanced structural technology to optimize the PCB assembly workflow.

• Optimized for Thick PCBs: Specifically designed for heavier, multi-layer telecom-grade boards, requiring a recommended PCB thickness of 2.36mm (0.093 inches) to ensure proper mounting engagement, signal integrity, and long-term mechanical stability.
• Tray Packaging for Automation: Supplied in standard tray packaging, ensuring delicate internal contacts and alignment pins are protected during transit and allowing for seamless integration into automated factory floor pick-and-place assembly lines.

Typical Applications

Combining massive 8-port stacked density, targeted visual diagnostics, industrial-grade thermal resilience, and robust stainless steel EMI shielding, the LP24AC01101 is the optimal interconnect housing for high-throughput network architectures:

• Data Center & Enterprise Switching: High-density Top-of-Rack (ToR) switches, core edge routers, and network aggregation devices demanding visually monitored, space-saving stacked port matrices.
• Telecommunications Infrastructure: Broadband access hubs, 5G baseband units (BBUs), and fiber-to-the-x (FTTX) optical line terminals (OLTs).
• Industrial & Edge Computing: Ruggedized industrial Ethernet switches and micro-data center nodes deployed in extreme temperature environments (-40°C to +85°C).
• Storage Area Networks (SAN): High-throughput Fibre Channel storage arrays and host bus adapters (HBAs) requiring dense physical layer protection.