TE 2170409-5 Compatible LINK-PP LP21BC01101 SFP+ 2x1 Port Cage Connector With Outer/Inner LightPipe

Product Specifications

Key Benefits of LINK-PP LP21BC01101 (TE 2170409-5 Alternative)

• Integrated Receptacle & Dual LightPipe Architecture: Houses the dual-tier 40-position electrical connector, metallic copper alloy cage shell, and outer/inner lightpipe optics in a single press-fit unit, eliminating separate SMT connector and lightpipe assembly steps.
• Independent Outer/Inner LightPipe Optics: Dual-path lightpipes capture SMT LED light from the PCB and route it separately to the front bezel, providing real-time visual link and activity diagnostics for both upper and lower ports without light bleeding.
• Thick Enterprise Board Matching (2.36mm / .093"): Specifically engineered for thick 2.36mm [.093 in] multi-layer PCB motherboards, ensuring optimal press-fit pin engagement, mechanical retention, and grounding stability.
• Vertical 2x1 Stacked Density Consolidation: Stacks two SFP+ ports vertically in a single column, doubling front-panel port capacity per linear inch of bezel width on 1RU/2RU switch line cards.
• Premium Copper Alloy 30u" Construction: Formed with 30µ" plated copper alloy, ensuring low transfer contact resistance, superior wear resistance over repeated module insertions, and enhanced thermal heat dissipation.
• Direct TE Cross-Reference Drop-In: Matches TE Connectivity 2170409-5 mechanical footprint, pinout, and panel dimensions for seamless secondary-source qualification and supply chain resilience.

2x1 Vertical Stacked Architecture with Integrated Receptacle & LightPipes

Engineered in compliance with SFP+ MSA (SFF-8431) mechanical specifications, the LINK-PP LP21BC01101 (compatible with TE 2170409-5) features a 2x1 stacked (two ports arranged vertically) architecture containing an integrated 40-position card-edge connector and precision outer/inner lightpipes. This all-in-one housing guarantees perfect alignment between electrical contacts, cage openings, and lightpipe exit ports on the front panel bezel.

Outer/Inner Dual Optical LightPipe Diagnostics

The pre-installed lightpipe assembly utilizes a dual-channel design where the "Outer" lightpipe routes LED status signals for one port and the "Inner" lightpipe routes status signals for the adjacent port. This clear optical separation allows hardware architects to implement comprehensive visual port diagnostics (link state, speed, and activity) directly on the switch front faceplate.

Thick 2.36mm (.093") PCB Substrate Press-Fit Integration

The right-angle board mount geometry and press-fit compliant pin structure are engineered specifically for thick 2.36mm [.093 in] multi-layer PCB substrates. This provides high mechanical holding force and reliable electrical contact across all PTH vias, preventing board flexing or pin displacement during cable latching and transceiver insertion.

EMI Shielded SFP+ Cage Design with External Springs

Operating dual stacked ports at high-frequency 16 Gb/s serial rates requires rigorous electromagnetic compatibility (EMC) design to control radiated emissions and prevent channel crosstalk between upper and lower ports.

360-Degree External EMI Shielding Springs

The LINK-PP LP21BC01101 incorporates external perimeter metallic spring contacts around both upper and lower port openings. When inserted through the front panel cutout, these springs establish low-impedance grounding against the chassis bezel, forming a continuous Faraday shielding barrier across the stacked 2x1 interface.

Corrosion-Resistant Copper Alloy 30u" Construction

Formed from high-conductivity copper alloy with a 30µ" plating finish, the cage housing delivers high structural rigidity, excellent mechanical wear resistance, and long-term corrosion protection across an industrial operating temperature range of -40°C to +85°C. This supports system-level EMC design requirements for equipment targeting FCC and CE compliance.

Press-Fit SFP+ Integrated Receptacle Assembly & PCB Integration

Designed for automated, high-reliability solderless PCB manufacturing, the LP21BC01101 utilizes precision compliant press-fit pin technology for signal, power, and ground contacts.

Solderless All-Through-Hole Press-Fit Termination

The combined assembly installs mechanically into host PCB plated through-holes (PTH) using a single controlled press insertion tool. This solderless Through-Hole Technology (THT) eliminates high-temperature SMT reflow ovens or secondary wave soldering operations, preserving high-speed signal integrity and simplifying line card production rework.

Target Applications: Enterprise Switches, SAN Storage Directors, and Industrial Telecom

Combining SFP+ MSA compliance, 2x1 vertical stacked density, outer/inner lightpipes, and 2.36mm PCB press-fit receptacle technology, the LINK-PP LP21BC01101 supports high-density networking systems:

• High-Density Enterprise Switches & Routers: Ideal for 10GbE Top-of-Rack (ToR) switches, enterprise core routers, and aggregation line cards requiring vertical port stacking and visual status diagnostics.
• Enterprise Storage Area Networks (SAN): Deployed in 16G Fibre Channel director modules, SAN storage expansion chassis, and host bus adapters (HBAs).
• Industrial & Edge Infrastructure: Suitable for extended temperature outdoor enclosures, 10G CPRI wireless base station units (BBU), and optical transport platforms (OTN).

How to Select and Verify an SFP+ Cage Assembly Replacement

When evaluating or sourcing 2x1 stacked SFP+ cage assemblies with integrated connectors and lightpipes for new line card designs or supply chain diversification, hardware engineers should verify the following core parameters:

• Integrated Receptacle & Lightpipe Configuration: Confirm whether your PCB footprint and faceplate require an all-in-one integrated 2x1 cage with pre-installed connector and Outer/Inner lightpipe channels versus discrete cages.
• PCB Substrate Thickness Compatibility: Ensure the press-fit pin tail length matches your motherboard thickness (LINK-PP LP21BC01101 and TE 2170409-5 are specifically optimized for thick 2.36mm [.093 in] PCBs).
• Mechanical Envelope Dimensions: Verify that the 63.25mm length, 14.00mm width, and 25.53mm height envelope fits within your card slot pitch and front bezel cutout dimensions.
• EMI Shielding Mechanism (External Springs vs Elastomeric Gaskets): Confirm whether your chassis bezel cutout design is optimized for metallic spring fingers (providing low contact resistance) or conductive elastomeric gaskets.
• Cross-Reference & Footprint Validation: Validate mechanical drawings, press-fit hole patterns, lightpipe exit dimensions, and grounding spring tolerances between TE 2170409-5 and LINK-PP LP21BC01101.