Switches
Magnetic & Optical Connectivity Solutions for Ethernet Switches
Modern Ethernet switches—from Layer 2 unmanaged devices to Layer 3 enterprise core switches—depend on reliable magnetic and optical interfaces to ensure network stability. LINK‑PP offers a full portfolio of RJ45 magnetic connectors, LAN magnetics, and optical transceiver integration solutions optimized for switch architectures, including those supporting Power over Ethernet (PoE).
Challenges in Ethernet Switch Interface Design
- Port Density — Many switches integrate 8, 24, or 48 ports, requiring compact RJ45 stacking and space-efficient layout.
- PoE/PoE+/PoE++ Delivery — Switches must handle up to 90W per port (IEEE 802.3bt), necessitating compliant magnetic isolation.
- EMI Performance — Shielded solutions are essential for enterprise-grade electromagnetic compliance (EMC Class B).
- Hybrid Fiber/Ethernet — Uplink ports often require seamless SFP/SFP+ integration for aggregation or uplink.
LINK‑PP Connectivity Solutions for Switches
Shielded RJ45 Magnetic Connectors
Designed for multi-port switches, these connectors integrate isolation transformers and common-mode chokes within a compact shielded housing. They support:
- 10/100/1000Base‑T and 2.5G/5G/10GBase‑T Ethernet
- IEEE 802.3af/at/bt PoE and PoE++ delivery
- Surface-mount (SMD) or through-hole packaging options
- Support for stacking layout in 8–48 port switch panels
High-Frequency LAN Magnetics
Discrete magnetics are deployed between PHY and RJ45 interface to ensure proper signal integrity and EMI suppression. Key capabilities include:
- Insertion loss < 1 dB @ 100 MHz; return loss > 16 dB
- High common-mode rejection (CMRR) for EMI shielding
- 1500Vrms isolation voltage between line and circuit
- Temperature range from –40°C to +85°C for industrial switches
Fiber Uplink: SFP/SFP+ Compatibility
For uplink or aggregation, most switches include SFP cages or embedded transceivers. LINK‑PP provides optical interface compatibility for:
- 1G / 10G SFP/SFP+ slots
- Multimode and single-mode configurations (SR, LR, BiDi)
- Optional cage integration with heatsinks and EMI gaskets
- Temperature range from –40°C to +85°C for industrial switches
Common Use Cases for LINK‑PP in Switches
- Unmanaged industrial switches in factories or edge computing environments
- Managed Layer 3 switches for enterprise and datacenter aggregation
- PoE switches powering IP cameras, access points, or VoIP endpoints
- Fanless embedded switches in smart cities, kiosks, or surveillance boxes
LINK‑PP’s components are trusted in large-volume production switches used across global telecom, surveillance, and industrial automation markets.
Why Engineers Choose LINK‑PP for Switch Interfaces
Feature | LINK‑PP Capability |
---|---|
Ethernet Speeds | 10M to 10GBase‑T |
PoE Support | IEEE 802.3af/at/bt up to 90W |
EMI Shielding | Shielded RJ45 + optimized magnetics layout |
Compact Design | Multi-port SMD stacking connectors |
Optical Uplink | Compatible with standard SFP/SFP+ transceivers |
Certifications | ISO 9001, RoHS, UL94V-0, IEC 60950 |
FAQ: Design Considerations for Switch Connectivity
Q1: How do switch magnetic modules differ from standard RJ45 jacks?
A: Switch magnetic modules integrate both transformer and EMI choke into one unit, optimized for high port count and PoE delivery, unlike generic RJ45s.
Q2: Can LINK‑PP solutions support PoE++ (IEEE 802.3bt)?
A: Yes. LINK‑PP’s magnetic RJ45 connectors and LAN magnetics are designed to handle up to 90W per port, compliant with PoE++ specifications.
Q3: Are LINK‑PP components compatible with Broadcom or Marvell switch ICs?
A: Absolutely. LINK‑PP components are tested for electrical compatibility with all major PHY and switch controller vendors.
Compliance and Engineering Reliability
LINK‑PP switch interface solutions meet the highest levels of production consistency and industry compliance:
- ✅ Certified to ISO 9001 manufacturing standards
- ✅ RoHS & REACH environmental compliance
- ✅ EMI testing meets FCC/CE Class B
- ✅ Materials conform to UL94V-0 flammability
- ✅ ESD, vibration, and thermal stress tested