TE 2198235-3 SFP+ Cage Ganged (1 x 6) With Heat Sink 16 Gb/s

Product Specifications

Key Benefits of TE Connectivity 2198235-3 SFP+ Cage Assembly

• Enhanced Passive Thermal Dissipation: Pre-assembled 9.1mm [.358 in] pin heat sink increases cooling surface area across all six ports, efficiently conducting heat away from power-intensive 10G/16G optical transceivers.
• Ultra-High-Density 1x6 Hex-Port Consolidation: Consolidates six SFP+ Enhanced ports into a single integrated housing, drastically reducing automated assembly placement steps and optimizing front-panel real estate on 1RU switch line cards.
• External Metallic EMI Spring Shielding: 360-degree perimeter spring fingers maintain resilient contact force against rigid chassis bezel cutouts for consistent high-frequency grounding.
• Thick Enterprise Board Matching: Tailored for heavy-duty 2.25mm [.089 in] motherboard substrates with 2.05mm press-fit compliant tails for optimal board retention and pin normal force.
• Streamlined Lightpipe-Free Airflow Design: Flat top profile eliminates lightpipe channels, maximizing vertical clearance for chassis forced airflow and simplifying line card layout.
• Multi-Source Availability: Industry-standard mechanical design enables secondary sourcing strategies to improve supply chain flexibility, lead-time management, and BOM optimization.

1x6 Ganged SFP+ Hex-Port Architecture with 9.1mm Heat Sink

Engineered in compliance with SFP+ Enhanced MSA (SFF-8431 / SFF-8432) mechanical specifications, the TE Connectivity 2198235-3 integrates a 1x6 ganged (six side-by-side ports) housing matrix with a pre-mounted 9.1mm [.358 in] pin heat sink. This medium-high profile heatsink configuration provides increased thermal interface contact for dense hex-port architectures generating elevated thermal loads.

Omnidirectional Pin Array Thermal Performance

The pre-mounted 9.1mm pin heat sink utilizes an omnidirectional pin array that disrupts thermal boundary layers regardless of chassis airflow direction. This ensures consistent thermal dissipation for extended-reach DWDM SFP+ optics and direct-attach copper cable assemblies in dense 1RU/2RU switch chassis.

Thick 2.25mm PCB Substrate Integration

The right-angle board mount geometry and 2.05mm [.081 in] press-fit tail length are optimized specifically for heavy-duty 2.25mm [.089 in] enterprise multi-layer PCBs. This guarantees ideal compliant pin compression inside plated through-holes, delivering high mechanical holding force and robust electrical grounding on dense network motherboard substrates.

EMI Shielded SFP+ Cage Design with External Springs

Operating six adjacent ports at high-frequency 16 Gb/s serial rates requires rigorous electromagnetic compatibility (EMC) design to control radiated emissions and prevent inter-port crosstalk.

360-Degree External EMI Shielding Springs

The TE Connectivity 2198235-3 incorporates external perimeter metallic spring contacts fitted around all six port openings. When pressed through the chassis front panel cutout, these springs maintain resilient ground contact against the metallic bezel, forming a continuous Faraday shielding barrier across the entire 1x6 hex-port interface.

Corrosion-Resistant Nickel Silver Construction

Formed from high-conductivity nickel silver, the cage housing delivers high structural rigidity, mechanical wear resistance, and long-term corrosion protection across an extended temperature range of -55°C to +105°C. This ensures long-term grounding integrity, supporting system-level EMC design requirements for equipment targeting FCC and CE compliance.

Press-Fit SFP+ Cage Features and PCB Assembly Integration

Engineered for automated, high-reliability solderless PCB manufacturing, the 2198235-3 utilizes precision compliant press-fit pin technology.

Solderless Compliant Pin Press-Fit Termination

The cage mounts mechanically into plated through-holes (PTH) on the host PCB using controlled press-fit insertion force. This solderless Through-Hole Technology (THT) eliminates wave soldering operations, protecting high-speed differential signal traces and surface-mount components from thermal reflow stress while enabling straightforward board repairability.

Target Applications: Enterprise Storage Directors, High-Density Switches, and Telecom

Combining SFP+ Enhanced MSA compliance, 1x6 hex-port density, and an integrated 9.1mm heat sink, the TE Connectivity 2198235-3 supports demanding high-speed networking deployments:

• Enterprise Storage Area Networks (SAN): Ideal for 16G Fibre Channel core director switches, SAN expansion arrays, and high-density storage controllers.
• Data Center Switching & Core Routers: Deployed in 10GbE Top-of-Rack (ToR) switches, aggregation routers, and high-port-count enterprise line cards.
• Telecom Transport Infrastructure: Suitable for 10G CPRI/eCPRI base station units (BBU), optical transport equipment (OTN), and outdoor edge enclosures.

How to Select and Verify an SFP+ Cage Assembly Replacement

When evaluating or sourcing 1x6 ganged SFP+ hex-port cage assemblies with heat sinks for new line card designs or supply chain diversification, hardware engineers should verify the following core parameters:

• Heat Sink Height Clearance: Confirm that the 9.1mm [.358 in] heat sink height fits within your chassis enclosure rack unit height envelope (1RU or 2RU) without hitting top cover panels.
• Port Matrix Configuration (1x6 Hex-Port): Confirm that a 1x6 single-row ganged footprint aligns with your front-panel I/O port density targets and PCB trace routing space.
• Recommended PCB Substrate Thickness: Ensure the 2.05mm tail length matches your target motherboard thickness (TE 2198235-3 is optimized for thick 2.25mm enterprise PCBs).
• EMI Shielding Type (External Springs vs Elastomeric Gasket): Confirm whether your chassis bezel cutout design is optimized for metallic spring fingers (providing low contact resistance) or conductive elastomeric gaskets.
• Mechanical Drawing Verification: Check heat sink clearance dimensions, press-fit hole layouts, and grounding spring tolerances against official engineering drawings when qualifying alternative suppliers.