2170030-1 TE SFP+ Cage Assembly 1 x 4 Port 16 Gb/s Included Lightpipe

Product Specifications

Key Benefits of TE Connectivity 2170030-1 SFP+ Cage Assembly

• High-Density 1x4 Quad-Port Consolidation: Consolidates four SFP+ ports into a single integrated 1x4 housing, reducing component placement count and maximizing front-panel I/O density on 1RU switch line cards.
• Ultra-Low Dual Round Lightpipe Optics: Integrated lightpipes feature an ultra-low profile footprint, guiding SMT LED light from the PCB to the front panel for clear, real-time port link/activity diagnostics without adding vertical height.
• Thick Enterprise Board Matching: Tailored for heavy-duty 2.25mm [.089 in] motherboard substrates with 2.05mm press-fit compliant tails for optimal pin retention and grounding performance.
• Belly-to-Belly PCB Layout Support: Engineered for belly-to-belly board layouts, enabling top-and-bottom PCB mounting to double total chassis port density per slot.
• 16 Gb/s High-Speed Performance: Fully compatible with 10GbE, 8G/16G Fibre Channel (FC), and high-frequency CPRI wireless transport protocols.
• Multi-Source Availability: Industry-standard mechanical design enables secondary sourcing strategies to improve supply chain flexibility, lead-time management, and BOM optimization.

1x4 Ganged SFP+ Quad-Port Architecture & Ultra-Low Lightpipe Optics

Engineered in compliance with SFP+ MSA (SFF-8431) mechanical specifications, the TE Connectivity 2170030-1 features a 1x4 ganged (four side-by-side ports) housing matrix. This multi-port architecture establishes uniform port-to-port pitch across the front panel, simplifying chassis bezel cutout alignment while streamlining automated board placement compared to four discrete 1x1 cages.

Ultra-Low Profile Lightpipe Optics & Belly-to-Belly Integration

The pre-assembled dual round lightpipes feature an ultra-low profile clearance curve along the top of the cage assembly. This allows the cage to fit seamlessly inside tight 1RU chassis faceplates or belly-to-belly PCB configurations where top-side vertical clearance is restricted, guiding light from board-mounted surface-mount LEDs cleanly to the front bezel without light bleeding between adjacent ports.

Thick 2.25mm PCB Substrate Integration

The right-angle board mount geometry and 2.05mm [.081 in] press-fit tail length are optimized specifically for thick 2.25mm [.089 in] enterprise multi-layer PCBs. This guarantees ideal compliant pin compression inside plated through-holes, delivering high mechanical holding force and robust electrical grounding on dense network motherboard substrates.

EMI Shielded SFP+ Cage Design with External Springs

Operating four adjacent ports at high-frequency 16 Gb/s serial rates requires rigorous electromagnetic compatibility (EMC) design to control radiated emissions and prevent inter-port crosstalk.

360-Degree External EMI Shielding Springs

The TE Connectivity 2170030-1 incorporates external perimeter metallic spring contacts fitted around all four port openings. When pressed through the chassis front panel cutout, these springs maintain low-impedance electrical contact against the metallic bezel, forming a continuous Faraday shielding barrier across the entire 1x4 quad-port interface.

Corrosion-Resistant Nickel Silver Construction

Formed from high-conductivity nickel silver, the cage housing delivers high structural rigidity, mechanical wear resistance, and long-term corrosion protection across an extended temperature range of -55°C to +105°C. This ensures long-term grounding integrity, supporting system-level EMC design requirements for equipment targeting FCC and CE compliance.

Press-Fit SFP+ Cage Features and PCB Assembly Integration

Engineered for high-yield automated press-fit PCB manufacturing, the 2170030-1 utilizes precision solderless compliant pin technology.

Solderless Compliant Pin Press-Fit Termination

The cage mounts mechanically into plated through-holes (PTH) on the host PCB via controlled press-fit insertion. This solderless Through-Hole Technology (THT) eliminates secondary wave or reflow soldering operations, protecting neighboring surface-mount components and high-speed signal traces from thermal reflow stress while enabling straightforward field repairability.

Target Applications: Enterprise Storage, Data Center Switches, and Telecom

Combining SFP+ MSA compliance, 1x4 quad-port density, ultra-low lightpipes, and robust press-fit termination, the TE Connectivity 2170030-1 supports high-density networking systems:

• Enterprise Storage Area Networks (SAN): Ideal for 16G Fibre Channel director line cards, SAN expansion switches, and high-density storage host bus adapters (HBAs).
• Data Center Switching & High-Density Routers: Deployed in 10GbE Top-of-Rack (ToR) switches, belly-to-belly motherboard line cards, and core aggregation routers.
• Telecom Transport Infrastructure: Suitable for 10G CPRI/eCPRI wireless base station units (BBU), optical transport platforms (OTN), and outdoor edge enclosures.

How to Select and Verify an SFP+ Cage Assembly Replacement

When evaluating or sourcing 1x4 ganged SFP+ quad-port cage assemblies for new hardware designs or supply chain diversification, hardware engineers should verify the following core parameters:

• Port Matrix Configuration (1x4 Quad-Port): Confirm that a 1x4 single-row ganged footprint aligns with your front-panel I/O port density targets and board trace routing space.
• Lightpipe Profile Clearance: Verify whether your chassis faceplate requires ultra-low profile lightpipe optics (such as dual round ultra-low lightpipes) to accommodate tight vertical clearances without panel interference.
• Recommended PCB Substrate Thickness: Ensure the 2.05mm tail length matches your target motherboard thickness (TE 2170030-1 is optimized for thick 2.25mm PCBs).
• Belly-to-Belly Alignment: Verify that the cage mechanical footprint supports top-and-bottom board mounting if deploying belly-to-belly line card architectures.
• Mechanical Drawing Verification: Check lightpipe exit dimensions, press-fit pin locations, and grounding spring tolerances against official engineering drawings when qualifying alternative suppliers.