TE 2349201-7 zSFP+ Cage Assembly 2x12 Port With Integrated Connector EMI Springs

Product Specifications

Key Benefits of TE Connectivity 2349201-7 SFP56 Cage Assembly

• Next-Generation 56 Gbps PAM4 Bandwidth per Channel (1.344 Tbps Total): Supports 50GbE PAM4 signaling and 56G Fibre Channel protocols, delivering up to 1.344 Tbps aggregate throughput across the 2x12 stacked 24-port assembly.
• Integrated 480-Position Receptacle, Cage & Lightpipe Architecture: Houses the 24-port 480-position electrical connector, metallic 2x12 cage shell, and optical lightpipes into a single press-fit assembly, eliminating 24 separate SMT host connector reflow steps and lightpipe mounting operations.
• Integrated Optical Status Diagnostics across 24 Ports: Pre-assembled lightpipe channels guide light from surface-mount LEDs on the PCB cleanly to the front bezel, providing clear visual link and activity status indication for all twenty-four stacked ports.
• Ultra-High 2x12 24-Port Density Consolidation: Arranges twenty-four SFP56 ports in a 2-row by 12-column matrix, dramatically increasing front-panel port capacity per linear inch of faceplate width on 1RU/2RU switch line cards.
• Enhanced EMI Spring Shielding for 56G PAM4: External perimeter metallic spring gaskets establish continuous, low-impedance grounding against front-panel bezel cutouts across all twenty-four stacked ports for high 56G PAM4 EMC performance.
• Multi-Source Availability: Industry-standard footprint allows deployment alongside compatible replacement alternatives from qualified suppliers like LINK-PP for BOM cost optimization.

2x12 Stacked 24-Port Architecture with Integrated SFP56 Receptacle & Lightpipes

Engineered in compliance with IEEE 802.3cd 50GBASE and SFP56 / zSFP+ MSA mechanical specifications, the TE Connectivity 2349201-7 features a 2x12 stacked (two rows high by twelve columns wide) architecture containing an integrated 480-position (20 pins per port x 24 ports) card-edge connector and precision lightpipes. Compared to 28G SFP28 designs, SFP56 interfaces double per-lane bandwidth using 4-level Pulse Amplitude Modulation (PAM4) while maintaining physical backward compatibility.

Visual Port Diagnostics & High-Density Contact Integration

The integrated optical lightpipes capture light emitted from PCB surface-mount LEDs and project it to front faceplate indicator ports above and below each socket. The right-angle board mount structure ensures reliable compliant pin compression for all 480 dual-tier receptacle signal contacts and cage retention legs inside multi-layer plated through-holes (PTH).

Enhanced EMI Shielding with External Spring Contacts

Operating twenty-four adjacent ports at high-frequency 56 Gb/s PAM4 serial rates requires rigorous electromagnetic compatibility (EMC) design to control radiated emissions and prevent channel crosstalk between adjacent vertical and horizontal ports.

360-Degree External EMI Shielding Springs Across 24 Ports

The TE Connectivity 2349201-7 incorporates EMI-enhanced external perimeter metallic spring contacts around all twenty-four port openings. When inserted through the front panel, these springs establish low-impedance grounding against the chassis bezel cutout, forming a continuous Faraday shielding barrier across the stacked 2x12 24-port interface.

Corrosion-Resistant Nickel-Plated Copper Alloy Construction

Formed from high-conductivity copper alloy with a protective nickel plating, the cage housing delivers superior mechanical stiffness, wear resistance over repeated module insertion/extraction cycles, and long-term corrosion protection across an extended operating temperature range of -55°C to +105°C. This supports system-level EMC design requirements for equipment targeting FCC and CE compliance.

Press-Fit SFP56 Integrated Receptacle Assembly & PCB Integration

Designed for automated, high-reliability solderless PCB manufacturing, the 2349201-7 utilizes precision compliant press-fit pin technology for signal, power, and ground contacts.

Solderless All-Through-Hole Press-Fit Termination

The combined assembly installs mechanically into host PCB plated through-holes (PTH) using a single controlled press insertion tool. This solderless Through-Hole Technology (THT) eliminates high-temperature SMT reflow ovens or secondary wave soldering operations, preserving high-speed signal integrity and simplifying line card production rework.

Target Applications: 50G/100G Data Center Switches, 56G SAN, and 5G Telecom

Combining SFP56 MSA compliance, 56 Gbps PAM4 per-channel bandwidth, 2x12 24-port stacked density, integrated lightpipes, and press-fit receptacle technology, the TE Connectivity 2349201-7 supports high-density networking systems:

• 50G / 100G / 200G Enterprise Switches & Routers: Ideal for 50GbE Top-of-Rack (ToR) switches, enterprise core routers, and 100G (2x50G) / 200G (4x50G) breakout line cards requiring visual status diagnostics.
• 56G Storage Area Networks (SAN): Deployed in high-density 56G Fibre Channel core director modules, SAN storage expansion chassis, and high-port-count controllers.
• 5G Wireless & Telecom Edge Infrastructure: Suitable for 50G eCPRI wireless base station units (BBU), optical transport equipment (OTN), and outdoor edge compute enclosures.

How to Select and Verify an SFP56 Cage Assembly Replacement

When evaluating or sourcing 2x12 stacked SFP56 24-port cage assemblies with integrated connectors and lightpipes for new line card designs or supply chain diversification, hardware engineers should verify the following core parameters:

• Integrated 480-Pin Receptacle & Lightpipe Configuration: Confirm whether your PCB footprint and faceplate require an all-in-one integrated 2x12 24-port cage with pre-installed 480-position connector and lightpipes versus discrete cages or lightpipe-free versions.
• Interface Speed & Modulation (SFP56 56G PAM4 vs SFP28 28G NRZ): Confirm whether the host system operates at 50G/56G PAM4 signaling rates (requiring SFP56 cages with lower transfer impedance and enhanced SI performance) or 28G NRZ rates.
• EMI Shielding Mechanism (External Springs vs Elastomeric Gaskets): Confirm whether your chassis bezel cutout design is optimized for metallic spring fingers (providing low contact resistance across 56G PAM4 interfaces) or conductive elastomeric gaskets.
• Press-Fit Mounting & Contact Compliance: Ensure PCB plated through-hole (PTH) drill diameters and copper plating thickness meet press-fit pin compliance.
• Mechanical Drawing Verification: Check 480-position press-fit hole patterns, lightpipe exit locations, and grounding spring tolerances against official engineering drawings.