TE 2342933-3 QSFP-DD Cage With Heat Sink Connector Press-Fit Through Hole

Product Specifications

Key Benefits of TE Connectivity 2342933-3 QSFP-DD Cage Assembly

• Maximum 13.5mm Passive Thermal Cooling Capacity: Pre-assembled 13.5mm [.531 in] extra-tall Networking riding heatsink delivers maximum cooling surface area, efficiently conducting heat away from power-intensive 400G transceivers and coherent ZR optics (up to 14W–18W+ per port).
• 8-Channel Double-Density Bandwidth (200G / 400G): Doubles port density compared to standard 4-lane QSFP cages by accommodating an 8-lane electrical interface supporting PAM4 and NRZ signaling formats.
• Heavy-Duty Stainless Steel Construction: High structural rigidity prevents cage wall deformation under heavy DAC/AOC cable strain and repeated module insertion/extraction cycles.
• Backward Compatibility with Legacy QSFP Modules: Accommodates standard 40G and 100G QSFP transceivers in addition to next-generation QSFP-DD optical engines.
• Advanced EMI Containment for High-Frequency Signaling: Perimeter metallic EMI spring gaskets establish continuous grounding against chassis bezel cutouts, minimizing electromagnetic leakage around pluggable interfaces.
• Solderless Press-Fit Manufacturing Flexibility: Precision compliant press-fit pins simplify board assembly, increase manufacturing yields, and avoid additional solder reflow thermal exposure on multi-layer PCB substrates.

1x1 QSFP-DD Architecture & 200G/400G MSA Compliance

Designed around QSFP-DD MSA specifications and IEEE 802.3bs standards, the TE Connectivity 2342933-3 is a single-port (1x1) QSFP-DD cage assembly constructed from stainless steel. It serves as the physical chassis foundation required to house high-power 200G (8x28G NRZ) and 400G (8x56G PAM4) optical transceivers, AOCs, and Direct Attach Copper (DAC) interconnects.

Extra-Tall 13.5mm Riding Heat Sink & Thermal Management

The pre-assembled 13.5mm [.531 in] Networking riding heatsink features a spring-loaded clip mechanism that maintains direct pressure against the top surface of inserted QSFP-DD transceivers. This extra-tall heatsink matrix significantly increases cooling fin surface area, preventing thermal throttling on power-hungry 400G ZR coherent optics consuming up to 18W. The cage structure maintains strict 100Ω differential impedance matching, minimizing channel skew across all 8 high-speed differential lanes.

EMI Shielded QSFP-DD Cage Design with External Springs

High-speed QSFP-DD interfaces operating at 56Gb/s PAM4 signaling rates (28 GHz Nyquist frequency) require careful electromagnetic compatibility (EMC) design and mechanical shielding to control radiated emissions and signal integrity risks.

360-Degree Active Metallic EMI Spring Gaskets

The TE Connectivity 2342933-3 features heavy-duty, highly resilient metallic EMI gasket springs fitted around the entire outer perimeter of the module port opening. When integrated into the chassis front panel cutout, these springs compress firmly against the metallic bezel, establishing a continuous, low-impedance grounding interface around the module opening to improve EMI containment performance.

High-Frequency Stainless Steel Shielding Structure

Constructed from a solid stainless steel body, the metal housing functions as an effective EMI shielding structure. It contains internal high-frequency noise generated by optoelectronic components while shielding board-level differential traces from external electromagnetic fields, supporting system-level EMC design requirements for equipment targeting FCC Class A and CE regulatory compliance.

Press-Fit Assembly Features & 1 Rear EON Pin Configuration

To support automated, high-yield manufacturing on dense motherboard layouts, the 2342933-3 is engineered with precision mechanical press-fit pins, including 1 rear Eye-of-Needle (EON) pin per port column.

Solderless Compliant Pin Press-Fit Integration

Equipped with precision compliant press-fit pins, the cage mounts onto the host PCB via mechanical insertion into plated through-holes (PTH). This Through-Hole Technology (THT) avoids additional solder reflow exposure on the PCB substrate, reduces exposure to solder-related thermal stress, and simplifies board repairability.

Target Applications: Enterprise Core Switches, 400G ZR Telecom, and SAN

Combining QSFP-DD MSA mechanical compliance, EMI shielding effectiveness, stainless steel durability, and an extra-tall 13.5mm heatsink, the TE Connectivity 2342933-3 supports mission-critical deployments across advanced networking architectures:

• Hyperscale 200G/400G Data Center Core Switches: Ideal for Top-of-Rack (ToR) switches, spine routers, and optical switching fabrics deploying high-wattage 400G optics requiring maximum passive cooling.
• 400G ZR Coherent Optical Transport Networks (OTN): Deployed in long-reach DWDM line cards and DCI (Data Center Interconnect) appliances.
• Enterprise Storage Area Networks (SAN): Suitable for high-density Fibre Channel director modules, SAN storage expansion chassis, and storage array controllers.

How to Select and Verify a QSFP-DD Cage Assembly Replacement

When evaluating or sourcing 1x1 single-port QSFP-DD cage assemblies with high-profile riding heatsinks for new line card designs or supply chain diversification, hardware engineers should verify the following core parameters:

• Riding Heat Sink Height & Chassis Vertical Clearance: Confirm that the 13.5mm [.531 in] extra-tall heatsink height fits within your chassis enclosure rack unit height envelope (recommended for 2RU, 3RU, or spacious 1RU designs) without hitting top cover panels.
• Transceiver Thermal Power Dissipation: Choose a 13.5mm heatsink over lower-profile options (such as 6.5mm) when deploying transceivers with severe thermal loads (>12W to 18W+), such as 400G ZR coherent optics.
• Cage Material Specification (Stainless Steel vs Copper Alloy): Confirm whether your chassis design requires high-rigidity stainless steel construction to resist mechanical deformation under heavy DAC cable strain.
• PCB Hole Layout & Press-Fit Tail Geometry: Confirm that PCB plated through-hole (PTH) drill diameters, including 1 rear EON pin per column, meet compliant pin press-fit insertion force specifications.
• Mechanical Drawing Verification: Check mechanical tolerances, grounding spring deflection dimensions, and physical envelope parameters against official drawings when qualifying alternative suppliers like LINK-PP.